POC-900 Series

AMD® Ryzen™ PRO 8640U Ultra-compact Embedded Computer with 4x PoE+, 4x USB 3.2 and MezIO® Interface

Features and Benefits

  • AMD® Ryzen™ PRO 8640U processor 15W-30W TDP with 6C/ 12T
  • 16 TOPs NPU with Ryzen™ AI, 31 TOPs for total SoC
  • Up to 32 GB ECC/ non-ECC DDR5 5600 SDRAM
  • 4x PoE+ GbE & 4x USB 3.2 Gen 2 with screw-lock
  • Dual HDMI™ 2.0b display output, Supporting 3840 x 2160 at 60Hz
  • Front I/O access and DIN-rail mounting design
  • -25°C to 70°C wide temperature operation
  • MezIO® interface for easy function expansion

Available to Order

Models

  • POC-915

Overview

How to Buy

Click “WhatsApp Us” or “Get a Quote” above to buy POC-900 Series from APulsar Technologies, NEOUSYS official distributor.

Purchase walk-in from our office in Petaling Jaya, or order online and enjoy fast delivery across Kuala Lumpur and the entire Malaysia.

Introduction

The POC-900 series is the latest addition to Neousys’ compact POC family, powered by the AMD® Ryzen™ embedded 8000 series platform. By retaining the same footprint, dimensions and DIN-rail mounting design as the current POC-700 and POC-500 series, the POC-900 ensures compatibility with existing installations while offering significant performance and connectivity upgrades.

Featuring the AMD® Ryzen™ PRO 8640U processor, the POC-900 offers up to 270% performance improvement over POC-500 platforms. In addition, its storage and memory have been enhanced, with support for M2 Gen 4×4 NVMe SSD and DDR5-5600 memory, they enable faster data access and improved system responsiveness for demanding edge AI and industrial applications.

The POC-900 provides four Gigabit Ethernet ports with PoE+, four USB 3.2 ports, and four digital inputs and outputs (DI/ DO) for connectivity with cameras, sensors, and control systems. In addition, it supports Neousys’ MezIO® interface, allowing flexible I/O expansion to meet specific application requirements. Combining next-generation AMD® performance with compact, rugged reliability, the POC-900 is engineered to deliver exceptional computing power and versatility for industrial automation, edge AI, and machine vision deployments.

 

Specifications

System Core

Processor

  • AMD® Ryzen™ PRO 8640U CPU (6C/ 12T, 3.5/ 4.9 GHz, 15W-30W TDP)

Graphic

  • AMD® Radeon RDNA3 Graphics

Memory

  • Up to 32 GB DDR5-5600 SDRAM (one SODIMM socket)

TPM

  • Supports dTPM 2.0

 

Ethernet

  • 4x Gb Ethernet ports by Intel® I350-AM4 (with WoL)

PoE+

  • IEEE 802.3at PoE+ on port #1~ 4
    – 32W power budget (with UL certified)
    – 100W power budget (maximum)

USB

  • 4x USB 3.2 Gen2x1 (10 Gbps) ports in type-A connectors with screw-lock

Video Port

  • 2x HDMI2.0b, Supporting 3840 x 2160 at 60Hz

Serial Port

  • 1x Software-programmable RS-232/422/485 ports (COM1)
  • 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)

Isolated DIO

  • 4-CH isolated DI and 4-CH isolated DO

Audio

  • 1x 3.5 mm jack for mic-in and speaker-out

M.2 M key

  • 1x M.2 2280 M key socket (PCIe Gen4 x4) for NVMe SSD

Mini PCI-E

  • 1x full-size mini PCI Express socket (PCIe + USB2) with internal micro SIM socket

Expandable I/O

  • 1x MezIO® expansion interface for Neousys MezIO® modules

DC Input

  • 1x 3-pin pluggable terminal block for 8 to 35V DC input

Remote Ctrl.& LED Output

  • 1x 3-pin pluggable terminal block for remote control and PWR LED output

Dimension

  • 64mm (W) x 116mm (D) x 176mm (H)
  • 92mm (W) x 116mm (D) x 176mm (H) (with fan)

Weight

  • 1.2 kg (fanless) or 1.4 kg (with fan)

Mouting

  • DIN-rail mount (standard) or wall-mount (optional)

Operating Temperature

  • -25°C ~ 70°C (15W TDP, fanless)
  • -25°C ~ 45°C (30W TDP, fanless)
  • -25°C ~ 70°C (30W TDP, with fan)

Storage Temperature

  • -40°C ~ 85°C

Humidity

  • 10%~90% , non-condensing

Vibration

  • MIL-STD-810H, Method 514.8, Category 4 (with wall-mount)

Shock

  • MIL-STD-810H, Method 516.8, Procedure I (with wall-mount)

EMC

  • CE/FCC Class A, according to EN 55032 & EN 55035

Safety

  • UL 62368-1, IEC 62368-1

Connector

  • DB9 male

Protocols

  • CAN 2.0A
  • CAN 2.0B

Signals

  • CAN_H, CAN_L, CAN_GND

Isolation

  •  2 kV (built-in)

Input Voltage

  • 00 to 240 VAC

Power Consumption

  • 90 W
    (without graphics card)

Power Connector

  • IEC 60320 C16 inlet

Housing

  • Metal

IP Rating

  • IP20

Dimensions

  •  440 x 360 x 88.1 mm (17.32 x 14.17 x 3.47 in)

Weight

  • RKP-C220-C9-T/C7-T/C5-T/C3-T: 8,913 g (19.65 Ib)
  • RKP-C220-C9-4L-T/C7-4L-T/C5-4L-T/C3-4L-T: 8,914 g (19.65 Ib)
  • RKP-C220-C9-8C-T/C7-8C-T/C5-8C-T/C3-8C-T: 9,196 g (20.27 Ib)
  • RKP-C220-C9-2CB6C-T/C7-2CB6C-T/C5-2CB6C-T/C3-2CB6C-T models: 9,062 g (19.98 Ib)

Installation

  • Rack mounting (standard 2U)

Operating Temperature

  •  -30 to 60°C (-22 to 140°F)  (without graphics card; refer to the graphics card operating temperature specification if applicable)

Storage Temperature

  •  -40 to 70°C (-40 to 158°F)

Ambient Relative Humidity

  •  5 to 95% (non-condensing)

EMC

  •  EN 55032/35

EMI

  •  CISPR 32, FCC Part 15B Class A
  • BSMI

EMS

  • IEC 61000-4-2 ESD: Contact: 4 kV; Air: 8 kV
  • IEC 61000-4-3 RS: 80 MHz to 1 GHz: 3 V/m
  • IEC 61000-4-4 EFT: Power: 1 kV; Signal: 0.5 kV
  • IEC 61000-4-5 Surge: Power: Line-to-PE: 2 kV; Line-to-Line: 1 kV, Signal: 1 kV
  • IEC 61000-4-6 CS: 3 V
  • IEC 61000-4-8 PFMF: 1 A/m at 50 to 60 Hz

Safety

  •  UL 62368-1 (CB)
  • BSMI

Shock

  •  IEC 60068-2-27

Vibration

  •  IEC 60068-2-64

Package Drop Test

  •  ISTA 1A

Package Vibration Test

  •  ISTA 1A

 

Green Product

  •  RoHS, CRoHS, WEEE

Time Source

  • Built-in RTC (real-time clock) with lithium-battery backup

Automatic Reboot Trigger

  • Built-in WDT

Time

  •  RKP-C220-C9-T/C7-T/C5-T/C3-T: 1,168,494 hrs
  • RKP-C220-C9-8C-T/C7-8C-T/C5-8C-T/C3-8C-T: 993,182 hrs
  • RKP-C220-C9-4L-T/C7-4L-T/C5-4L-T/C3-4L-T: 1,101,194 hrs
  • RKP-C220-C9-2CB6C-T/C7-2CB6C-T/C5-2CB6C-T/C3-2CB6C-T: 995,157 hrs

Standards

  • Telcordia (Bellcore), GB

Warranty Period

  • 3 years